1. Design and simulation
     Electrical simulation, thermal management and thermal mechanical reliability simulation, process simulation.
2. Advanced Packaging
      a) SiP packaging, advanced sensor packaging, high-speed and high-density packaging, high-speed and high-frequency packaging,
          CIS packaging, 3D packaging.
      b) Substrates: high density substrates, coreless substrates, glass substrates.
3. Testing
      c) Electrical test:signal integrity, power integrity, analog, digital, RF, EMI.
      d) Reliability test and failure analysis:a variety of advanced reliability test and failure analysis equipment, such as DMA, TMA, TGA, X-ray.
      e) Thermal test