先进封装:创新之心

2019-02-20

先进封装与系统集成技术研讨会 – 4月22至23日中国上海

  半导体产业2017年表现不俗,有数字为证:增长率超过21.6%,达到4120亿美元左右。毫无疑问,该产业正在迈入一个崭新的时代,创新和颠覆是这个时代的关键词。除了移动设备,Yole的分析师们指出大数据、AI、5G、HPC、IoT、智能汽车、工业4.0、数据中心等正成为改变我们这个世界的新兴强大驱动力。所有这些正在变成我们的生活日常并对半导体产业及其供应链产生直接影响。不仅如此,Yole在其最新报告《先进封装产业态势》中预测,先进封装市场将以7%的年均复合增长率在2023年达到390亿美元的惊人规模......

  “大趋势带来的显著影响带动市场风向发生转变,也由此推动先进封装的发展,”Yole半导体与软件部主管Emilie Jolivet解释道:“Yole和华进半导体(NCAP)已决定要在今年再度联手,结合各自的专业优势,在上海举办先进封装与系统集成技术研讨会,紧随其后的就是中国国际电子生产设备暨微电子工业展(NEPCON)。这次在上海举办的会议能让各方了解产业发展并估量大趋势带来的影响。”

  华进半导体与Yole为先进封装产业量身定制了一系列创新活动日程:先进封装与系统集成技术研讨会将在2019年4月22日至23日在中国上海举行。为期2天的会议讨论将涵盖封装产业的方方面面,包括面板级、扇出型、系统级封装、先进基板和3D技术。会议将重点聚焦关键应用领域,如AI、HPC、存储器、运输(48V、EV/HEV、嵌入式晶片封装平台、PCB、先进基板……)、5G和消费类等等都将是会议的中心议题。两家联合主办方诚邀您与业界领袖的高管会面,深入了解市场的演化发展! 

  大趋势在各种先进封装平台之间创造了巨大的商机,因此先进封装技术在满足更高性能和复杂的异构集成需求方面正是理想之选。

   “我们预测未来将从尺寸和功能衍生出两类先进封装发展路线,”Yole韩国分公司封装、组装与基板业务主管兼首席分析师Santosh Kumar称:“而且半导体产业正在为这两者都开发产品。先进封装可以为半导体产品提升价值,在降低产品成本的同时增加其功能性,并维持或提高其性能……”

  根据Yole半导体与软件团队所开发的这两类发展路线,未来将出现更多的多芯片异构集成,也就是所谓的系统级封装,还将有更高层面的封装定制。无论是高端还是低端产业,无论是针对消费型、性能型还是专用型应用领域,各式各样的系统级封装都在开发中。异构集成无疑已经为基于基板和WLP的系统级封装都创造了机会……
不仅如此,先进封装供应链也在这个传奇故事中占有一席之地。业界领袖、初创公司、研发机构,全球先进封装产业都参与其中。为了拓展业务、探索新的领域并准备好迎接未来的不确定性,先进封装领域的企业都在向不同的经营模式转变:

• 部分像英特尔这样的IDM正在进入代工市场,以发挥其在前端技术上的专长,并通过利用自身的富余产能增创收益。三星、SK海力士半导体也都在此列......
• OEM厂商、软件与服务公司正在设计自有芯片并控制着与之相关的设备与材料供应链。部分OSAT想在AI这样的大趋势上碰碰运气,正在向轻晶圆厂的商业模式拓展。
• 包括台积电(TSMC)、武汉新芯(XMC)、联华电子(UMC)和中芯国际(SMIC)在内的单纯代工厂正在涉足高端封装业务,为其客户提供一站式解决方案。
• 像Amkor Technology、江苏长电(JCET)/STATS ChipPAC、日月光(ASE)、矽品(SPIL)、力成科技(Powertech Technology)等这样的OSAT正以相当可观的投入开发先进晶圆级和3D IC封装产能,以支持尺寸和密度方面的需求。OSAT公司正在扩展其测试专长,而传统的测试公司则在组装与封装产能上进行投入。 
• 基板制造厂商正以面板级扇出型封装和有机薄膜中的嵌入式晶片打入先进封装领域。

  正如标题所述,先进封装就是创新之心。大趋势应用正带来新的挑战,全球领先的先进封装公司将齐聚先进封装与系统集成技术研讨会,交流彼此的愿景和对未来的看法。
华进半导体总经理曹立强博士称:“在中国十三五计划和中国制造2025两项计划的背景下,包括华进半导体在内的国内企业关注半导体产业的核心技术开发,并取得了重大进展。促进先进封装方面的国际沟通和全球合作是Yole和华进半导体的共同目标,也是我们坚持组织本次活动并使之成为一年一度盛事的原因。凭借着良好声誉、热门议题和富有洞见的演讲,我们坚信2019年的研讨会将大获成功。不要错过这个了解技术趋势并拓展您在华业务的好机会。”

  2019年,Yole和华进半导体策划了一场独一无二的先进封装与系统集成技术研讨会,分析先进封装产业现状并帮助企业成为这“明日”产业的一份子,活动不容错过! 
如需了解更多研讨会的相关信息(活动日程、演讲者名单、社交联络和赞助),敬请联系华进半导体战略部xiaoyunzhang@ncap-cn.com 或Yole市场与沟通总监Camille (veyrier@yole.fr )。

原文译自:Advanced packaging: at the heart of innovation,

原文请参考:http://www.yole.fr/AdvancedPackagingIndustry_NCAP_YOLE_Symposium.aspx#.XGpsbOQzbIV



ABOUT THE REPORT: 



Status of the Advanced Packaging Industry 
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development. – Produced by Yole Développement (Yole).

Companies cited in the report:

Altera, Amkor, Analog Devices, Ardentec, Atmel, AOI Electronics, Apple, ARM, ASE, Avago, Broadcom, Carsem, China WLCSP, Chipbond, ChipMOS, Cisco, Cypress Semiconductor… Full list

Author:

Santosh Kumar
is Director of Packaging, Assembly, and Substrates at Yole Korea. He is involved in the market, technology, and strategic analysis of microelectronic assembly and packaging technologies. His main interest areas are advanced IC packaging technology, including equipment and materials. He has also authored several reports on fan-out/fan-in WLP, flip chip, and 3D/2.5D packaging. 
Santosh received a bachelor’s degree and master’s degree in Engineering from the Indian Institute of Technology (IIT) Roorkee and the University of Seoul, respectively. He has published more than 40 papers in peerreviewed journals and has obtained two patents. Moreover, Santosh has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.

ABOUT NCAP

The National Center for Advanced Packaging Co., Ltd. (NCAP China) is a joint venture established by ten investors, including the leaders of the IC packaging and testing industry in China. NCAP’s goal is to establish a world class R&D center for advanced packaging and system integration, play a leading role in the development and marketing of advanced technologies for microelectronics packaging and system integration, and promote and sustain the technological and commercial progress of the microelectronics industry in China.
As a national center for advanced packaging, testing and system integration, NCAP, in collaboration with system OEMs and supply chain partners, aggressively pursues research and development in order to offer complete solutions for the IC industry. NCAP’s current research areas include: 2.5D/3D technology (including TSV), high-density wafer level packaging, SiP product development capabilities, and certain advanced materials and equipment technologies for microelectronics packaging.
The NCAP R&D platform includes a 3200-m² fully equipped cleanroom, for 300mm wafer size, for 2.5D/3D IC backend processes, and packaging assembly, testing and reliability, as well as design and simulation capabilities. More information on www.ncap-cn.com

ABOUT YOLE DEVELOPPEMENT

Founded in 1998, Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS & Sensors - Imaging - Medical Technologies - Compound Semiconductors - RF Electronics - Solid State Lighting - Displays - Photonics - Power Electronics - Batteries & Energy Management - Advanced Packaging - Semiconductor Manufacturing - Software & Computing and more...
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business. For more information, visit www.yole.fr and follow Yole on LinkedIn and Twitter.
• Consulting & Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
• Reports: David Jourdan (jourdan@yole.fr)
Yole Développement, System Plus Consulting, Knowmade, PISEO and Blumorpho are part of Yole Group of Companies. Yole Group of Companies - Press Relations & Corporate Communication: Sandrine Leroy (leroy@yole.fr)