【第十一期】华进论坛 Adhesion and Thermomechanical Reliability in Device Technologies

2015-03-27

时间:2015年4月2日(星期四)9:00-12:00

地点:NCAP F6培训室

主讲人:Reinhold H. Dauskardt

讲座性质: R公开   □非公开

主办单位:华进半导体封装先导技术研发中心有限公司

     沈阳拓荆科技有限公司

 

 

 【讲座概要】

Materials and interfaces in emerging devicetechnologies operate near the envelope of their mechanical and adhesiveproperties with remarkably high levels of film stress. Debonding and cohesivefracture are major challenges for device reliability at all levels ofprocessing, packaging and service. The thermomechanical properties of devicestructures including complex back-end interconnect and emerging 3-D structuresare critical for aiding new materials integration as well as understandingdevice reliability.

We describe research aimed at characterizingthin-film thermomechanical properties including adhesion and cohesion that arecritical for emerging device technologies. Particular challenges of integratingnanostructured materials like nanoporous ULK materials and ultra-thin barriersare considered. Using a combined molecular modeling and materials synthesisstrategy we show how manipulating the composition and molecular structure ofULK materials can be used to optimize thermomechanical properties.

Packaging advanced silicon devices has becomeincreasingly challenging because the effects of stresses exerted oninterconnect and through-via structures during processing and package assemblyare not well characterized or understood. Accordingly, we describe a microprobemetrology which can precisely impose both normal and shearing stresses tolocalized regions of these structures. The intent is to quantitatively measure local stiffness, strength,deformation, and damage processes and relate them to stresses that may beexperienced during device packaging or assembly of 3D structures. 

We finally consider how fabrication or operatingenvironments may affect device reliability. We will particularly consider the synergistic effects of environmentalspecies like water and surfactant molecules, mechanical stresses, temperatureon the kinetic processes of damage formation and growth.  These are central to understanding andpredicting device reliability through processing and service.

【主讲人简介】

Reinhold H. Dauskardt博士是材料科学与工程系的Ruth G. 和 William K. Bowes教授,同时受聘于机械工程,生物设计学院和医学院外科系。他的研究团队致力于将新材料融入到新兴设备和能源科技,生物机械以及人类皮肤和软组织的再生过程。他是热机械可靠性方面国际公认的专家,倡导薄膜结构中黏附力和内聚力特性的量化方法。实验研究中进行了计算和模型模拟。他得过许多奖项,其中包括Maso奖以表彰对皮肤科学的基本贡献(2011),IBM大学研究奖为表彰他的科学技术研究成果(2011),半导体工业协会大学研究奖以表彰他的研究对半导体工业科学和技术实质性和持续性的贡献(2010),IBM学院奖(2006),ASM国际银质奖章(2003),亚历山大•冯•洪堡研究奖(2002),美国能源部杰出科学成就奖(1989)。他是美国陶瓷协会(2008)和ASM国际组织(2010)的会员。他的跨学科研究包括与学术,工业和临床的研究人员相互合作。他已经在科学文献中出版300多篇文章。