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Our history 公司历史

As an innovation model, National Center for Advanced Packaging Co., Ltd. (NCAP China) was registered in Wuxi New District, China, in September 2012. It is established by ten investors, including the leaders of the IC packaging and testing industry in China (Jiangsu Changjiang Electronics Technology, TongFu Microelectronics, Huatian Technology, Shennan Circuit Company, China Wafer Level CSP, AKM Electronic Technology (Suzhou), Jiangsu CAS Internet-of-things Technology Venture Capital, Shenzhen Fastprint Circuit Tech) and CDB Capital.

华进半导体封装先导技术研发中心有限公司于2012年9月在无锡新区正式注册成立。公司英文全称为:National Center for Advanced Packaging Co., Ltd. (NCAP China) 。公司是由中科院微电子所和集成电路封测产业龙头企业长电科技、通富微电、华天科技、深南电路、苏州晶方、安捷利(苏州)、中科物联、兴森快捷九家单位以及国开基金共同投资而建立。


Our focus 公司业务

As a national center for advanced packaging, testing and system integration, NCAP aggressively pursues research and development through close collaboration with industry, colleges and institutes, in order to offer total solutions for the semiconductor industry. NCAP’s current research directions include: 2.5D/3D TSV and integration technologies (including TSV, bumping, via-reveal and chip-stacking), high density wafer level packaging, SiP product application and development, and verification and development of related advanced materials and equipment for microelectronics packaging.

 公司作为国家封测/系统集成先导技术研发中心,通过以企业为主体的产学研用结合新模式,开展系统级封装/集成先导技术研究,研究领域包括2.5D/3D 硅通孔(TSV)互连及集成关键技术、晶圆级高密度封装技术、SiP产品应用以及与封装技术相关的材料和设备的验证、改进与研发,为产业界提供系统解决方案。

 

Our core values 公司理念

Collaboration, Innovation, Perseverance, and Excellence

 

Vision & Mission 愿景使命

Vision 愿景

World Class R&D and Commercialization Center for Advanced Packaging & System Integration国际一流的封装与系统集成先导技术研发与产业化中心

Mission 使命

Innovate – Global Technology Leader in Microelectronics Packaging

创新 – 引领微电子封装与系统集成技术发展

Incubate – Commercialization Center for Microelectronics Packaging Technologies in China

应用 – 规模化成套技术转让能力

Influence – Leader and active participant in global collaboration

影响 – 推动国内外产学研用合作
Impact - Enabler of Eco-System for Microelectronics Packaging Industry in China

带动 – 推进微电子封装产业全方位生态体系


  在今后几年中,公司将针对未来半导体封测先导技术进行研究和开发,立足于我国集成电路和电子制造产业特色,在主流技术和产业发展上赶上和部分超越国外先进水平。并通过多种方式,形成可持续发展能力和规模化成套技术转让能力,持续支撑国内封测产业技术升级。结合上下游产业链的需求,建设成为行业共性技术研发平台、产业孵化和人才培养基地。


  公司正在招才引智,组建经营和研发团队,现诚邀您的加入!

 


Contact us 联系我们

Tel  电话:86-510-66678650

Fax 传真:86-510-66678653

Email 邮箱:zhaopin@ncap-cn.com

Add 地址:Building D1, China Sensor Network International Innovation Park, 200 Linghu Boulevard, Wuxi City, Jiangsu Province, China

江苏无锡新吴区菱湖大道200号中国传感网国际创新园D1栋