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晶圆级扇出封装

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2019-10-13_115325


#

Item

Capability/Spec

Comment

1

Incoming Si wafer size

6”, 8”, 12”


2

Si wafer grinding Thk

≥150um

W/O Pillar

3

PnP die size range

1.0 x1.0mm~ 8.0x8.0mm


4

PnP passives size range

0402, 0603


5

Molding Thk range

0.5~ 1.0mm


6

RDL L/S

10/10um


7

RDL Layer

2 layers


8

BGA size

200um